I am a PhD program student in the University of Cambridge and UCL, I obtained Master’s degree in Integrated Circuit Design at The Hong Kong University of Science and Technology.

My research interest includes Photonics System Design, Machine Learning and advanced Algorithm for Optimal Design.

You’ll find my curriculum vitae uploaded here: Song Menglin’s CV.

My Personal Statement here: Song Menglin’s PS.

🔥 News

2024.7: 🎉Sharing Experiences as an Outstanding Graduate of HKUST in ICDE
2024.4: 🎉🎉🎉 Receiving offer of PhD Program from CEPS from the University of Cambridge and UCL
2024.2: 🎉 “A Novel Passive Intermodulation Model of Coaxial Cable Assemblies with Distributed and Point-source Nonlinearities” successfully accepted by IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY
2023.12: 🎉 Winning the third prize in the Integrated Circuit EDA Elite Challenge at the national level
2023.10: 🎉🎉 Obtained the “Entrance Scholarship Prize” by School of Engineering in HKUST (This ratio is below 10%)
2023.09: 🎉 Started the MSc study in HKUST🏫
2023.08: 🎉 Successfully submitted the thesis entitled “A Novel Passive Intermodulation Model of Coaxial Cable Assemblies with Distributed and Point-source Nonlinearities” in the IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY
2023.07: 🎉 Participated in the Advanced Integrated Circuit EDA Summer Conference conducted by Beijing University.

📝 Publications

M. Song, Q. Jin

High-precision Mathematical Modelling of Passive Intermodulation in Connectors, Electronics Letters, M. Song, Q. Jin, Electronics Letters(SCI Journal) 2022
A Novel Passive Intermodulation Model of Coaxial Cable Assemblies with Distributed and Point-source Nonlinearities, R. Liu, Q. Jin, M. Song, et al. Transactions on Microwave Theory and Techniques(SCI Journal)
Patent:
Title: A fitting method for a passive intermodulation (PIM) mathematical model Patent Number: 023108822605

2023.10 Entrance Scholarship in HKUST (Less than 10% in the major)
2022.06 Best Graduation Thesis (The only 1 in the major, 2% in the Bachelor’s school)

*2024.09 - 2028.06 *, University of Cambridge & UCL; MRes+PhD of Research in Connected Electronic and Photonic Systems
*2023.09 - 2024.06 *, The Hong Kong University of Science and Technology; Master of Science in IC Design Engineering
2018.09 - 2022.06, Southwest Jiaotong University; Bachelor of Engineering in Electronic Science and Technology

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2022.07 - 2023.05, Texas Instruments,Analog Chip Product Engineer Chengdu, China/ Dallas, USA/KL, Malaysia.